Ansys Additive Suite

完整的積層製造解決方案

使用 Ansys Additive Suite，使用者可存取所有積層製造功能，包括零件幾何與資料準備、列印過程模擬以及科學分析。

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概覽
功能

完整的工作流程解決方案

成功的積層製造工作流程所需的關鍵洞察

Ansys Additive Suite 是適合設計師、工程師和分析師的完整解決方案，涵蓋了整個工作流程，從積層製造設計 (DfAM) 到驗證、印刷設計、程序模擬和材料探索。

簡要規格

Ansys Additive Suite 是一套完整的工作流程解決方案，能提供設計師、工程師和分析師所需的關鍵見解。從積層製造 (DfAM) 的設計、驗證到列印設計等等，此解決方案橫跨整個工作流程，有助於避免建立故障，並提供準確設計的零件。

拓撲和晶格最佳化

完整的輸入和輸出條件

金屬 PBF 程序模擬

變形補償

建立故障預測

材料分析

熔化池、孔隙度和微結構預測

設計驗證

結構及散熱分析

程序模擬

材料分析

March 2026

What's New

Ansys Additive 2026 R1 advances AM simulation with enhanced thermal build control, G‑code‑driven geometry and material modeling, and faster process‑parameter exploration.

New Build Sequence Controls in Mechanical

New AM Build Sequence Controls in Ansys Mechanical enable more realistic additive manufacturing simulations, including EBM processes. Users can define region‑specific heating and cooling conditions and apply different process temperatures to multiple materials within a single load step, improving accuracy and flexibility in AM thermal analysis.

DED Updates

DED workflows are enhanced with a streamlined path from G‑code to simulation, including multi‑axis G‑code reading with tool orientation, expanded support for customizable bead cross‑sections, and direct geometry generation. Material orientation can now be derived directly from the G-code file, enabling path‑aware anisotropic material modeling for metal and composite additive manufacturing.

Additive Process Parameter (AMPP) in App Catalog

The AMPP app enables efficient exploration of laser powder‑bed fusion process parameters through a simple study setup and tabular simulation management. Users can evaluate bead behavior, porosity, and microstructure, compare results side‑by‑side, reuse studies from CSV files, and leverage both Ansys and custom AM material libraries for deeper insight.