Skip to Main Content

2021

Webinar

Electrothermal Signoff for 2.5D and 3D IC Systems [2021]

The move to advanced designs and packaging as well as 2.5D/3D multi-die systems has created many challenges. The only way to predict the behavior of these very complex designs is through concurrent multiphysics analysis across multiple performance parameters. This webinar introduces Ansys RedHawk-SC Electrothermal, a new analysis tool that provides comprehensive simulation of multi-die packages for electrical, thermal, electromagnetic and mechanical sign-off.

What you will learn

In this webinar, we cover how RedHawk-SC Electrothermal analyzes 2.5D/3D designs for: 

  • Early prototyping of multi-die packages 
  • Power integrity and signal integrity signoff methodologies 
  • Heterogeneous data input and unified GUI 
  • Links to system-level analysis tools

 

SHARE THIS WEBINAR

Ansys가 귀사를 위해 무엇을 할 수 있는지 알아보십시오.

문의하기

* = 필수 항목

문의해 주셔서 감사합니다!

We’re here to answer your questions and look forward to speaking with you. A member of our Ansys sales team will contact you shortly.

바닥글 이미지