Skip to Main Content

Ansys 2022 R1: Electronics Reliability Update

Learn about the latest advancements and new tool integrations in Ansys Electronics Reliability solutions.


Register Now

This site is protected by reCAPTCHA and the Google Privacy Policy and Terms of Service apply.

About this Webinar

Ansys 2022 R1 introduces significant advances across the Ansys suite of tools supporting Electronics Reliability applications. In addition to critical enhancements within Ansys Sherlock, Mechanical, LS-DYNA, and Icepak, new tool integrations and workflow solutions advance state-of-the-art simulation.

What Attendees Will Learn

  • Ansys Sherlock Integration with Ansys AEDT Icepak 
  • Enhanced Ansys Sherlock + Ansys Mechanical Reinforcements Workflow 
  • Chip- and Die-Level Model Pre-Processing Enhancements in Ansys Sherlock 
  • Ansys Mechanical Trace Mapping Enhancements
  • Scripting, Automation, and Design Exploration Workflow Enhancements

We'll also discuss additional enhancements to Ansys Sherlock, Mechanical (including powerful meshing enhancements), LS-DYNA, and Icepak that provide additional insights and improve productivity.

Speaker: Kelly Morgan, Principal Application Engineer, Ansys