Power integrity and signal integrity simulation for any IC should be performed with the power noise model of the IC, along with a detailed model of the package and board.
- Ansys RedHawk-SC for chip power modeling
- RedHawk-SC for chip signal modeling
- RedHawk-SC ElectroThermal/Ansys SIwave for package modeling
- RedHawk-SC ElectroThermal for chip thermal modeling
- Ansys Icepak for system level thermal modeling chip-aware system and system-aware chip design, CPM, CTA, CTM, etc.