Manage power delivery from grid to rack and maximize uptime
Anticipate signal and power requirements, thermal interactions, and structural integrity issues from chip to rack across scales, ensuring reliable performance of processors, accelerators, memory, servers, racks, power delivery, networking, and thermal management systems.
Boost high-density interconnect speed and efficiency
Enhance performance and reliability by analyzing thermal, electrical, and mechanical behavior of co-packaged optics, optimizing signal integrity, power delivery, and packaging reliability in high-density AI factory environments.
Increase cooling efficiency, minimize thermal risk
Predict airflow, heat transfer, and cooling effectiveness across servers, racks, containment and air/liquid cooling systems through conjugate heat transfer analysis, improving thermal design, reliability, and data center energy efficiency.
Monitor, simulate, and optimize operations continuously
Leverage digital twin technology to simulate and predict failures, monitor performance from component to facility level, and optimize operations in real time − improving load handling, reliability, and energy efficiency.
