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Reliability Challenges with Heterogenous Integration

Join this webinar to learn how to mitigate potential reliability issues of heterogenous integrated electronic packaging through a combination of material characterization testing and simulation.

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About this Webinar

Heterogeneous integration refers to assembling multiple unique chips into a single packaged component. Emerging technologies such as artificial intelligence, the Internet of Things, and 5/6G communication require these advanced electronic packaging architectures in order to meet the demand for higher computing speed and greater functionality given the recent slowdown of Moore’s law.

Though heterogeneously integrated packages meet the demand for increased speed, changes to the package architecture, the introduction of new materials, and the incorporation of new interconnect geometries give rise to new reliability challenges. Modeling these reliability challenges will be the focus of this webinar.

What You Will Learn

In this webinar, we will focus on: 

  • Development of advanced package architectures 
  • Mitigating reliability challenges by a combination of material characterization testing and simulation to predict durability

Who Should Attend

Electronics Packaging Engineers, Electrical Engineers, Mechanical Engineers, Reliability Engineers

Speakers

Jonathan Kordell

Thermal Degradation