Ansys 2025 R2: Ansys Sherlock and Electronics Reliability What’s New

Overview

In this latest update, discover the latest capabilities and highlights of Ansys Sherlock 2025 R2, focusing on electronics reliability. We'll cover a wide range of model updates, PySherlock enhancements, and integrations with other Ansys products. 

Updates include updates to the soldier fatigue model that improve accuracy and flexibility across BGA, CGA, and IMS components, with new support for Distance to Neural Point (DNP) and calibration factors for BGA and CGA models. PySherlock now supports pre-layout workflows where ECAD files are not yet available, with a new API to import GDSII files, helping to streamline chip and die-level workflows in the creation of high-fidelity models. This release includes additional commands for working with PTH fatigue, semiconductor wearout, and component failure mechanism analysis. In addition, Sherlock's TMAP integration with IcePak streamlines to support multiple board datasets and enables the quick duplication of thermal maps to provide offset temperatures, greatly improving the ease of use for multi-board evaluations and "what if" studies.

What Attendees Will Learn

• Sherlock Fatigue Model Updates
• PySherlock Updates
• Sherlock / Icepak TMAP Updates

Who Should Attend

• PCB Designers, Reliability Engineers, Mechanical Engineers, Thermal Engineers, PCB Reliability Engineers

Speakers

• Kelly Morgan - Senior Principal Application Engineer, Ansys