Case Study
Ansys는 학생들에게 시뮬레이션 엔지니어링 소프트웨어를 무료로 제공함으로써 오늘날의 학생들의 성장을 지속적으로 지원하고 있습니다.
Ansys는 학생들에게 시뮬레이션 엔지니어링 소프트웨어를 무료로 제공함으로써 오늘날의 학생들의 성장을 지속적으로 지원하고 있습니다.
Ansys는 학생들에게 시뮬레이션 엔지니어링 소프트웨어를 무료로 제공함으로써 오늘날의 학생들의 성장을 지속적으로 지원하고 있습니다.
Case Study
“Using Ansys Icepak software for our automotive interior lighting project transformed our approach to thermal management. The accurate simulations saved us time and allowed us to optimize material choices without the need for costly prototypes. Ansys has been a vital partner in our development process.”
— Antoni Vilatimó, Laboratory Engineer, Elausa
In the automotive industry, effective thermal management of electronic components is crucial, especially in space-constrained environments like interior ambient lighting. This project involved a new type of light-emitting diode (LED) with integrated circuits (ICs), needing a thorough understanding of thermal behavior to ensure reliability.
The primary challenge was managing the power output of the LED printed circuit board (PCB) in high ambient temperature and within a limited space surrounded by plastic materials, which restricted airflow. The team required a simulation tool that could accurately model thermal performance and integrate seamlessly with existing electronic computer-aided design (ECAD) systems. Ansys Icepak® electronics cooling simulation software was chosen for its usability, precision, speed, and excellent technical support.
To address the thermal management challenge, the team utilized Icepak software to perform comprehensive simulations of the PCB. Key features that facilitated their success included:
Icepak software provided significant advantages throughout the development process.
By utilizing Icepak software, the team successfully maintained low operating temperatures to enhance the reliability and lifespan of their automotive lighting solutions.
여러분의 질문에 답변해 드리기 위해 최선을 다하겠습니다. Ansys 담당 엽업이 곧 연락을 드릴 것입니다.