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Designing Densely Packed LC Filters With Ansys HFSS and Modelithics

Learn about how using sophisticated 3D models of components makes all the difference in lumped RF filter designs. Ansys technology partner Modelithics will discuss the attributes of their component libraries which lend themselves effectively to EM simulation using Ansys HFSS, and provide design examples of LC filter designs.


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About this Webinar

Accurately simulating the real-life performance of filters designed with surface-mount components is challenging due to component parasitics. The challenges are greater when components close to one another can introduce coupling effects that impact overall performance. Overcome these challenges by using EM simulation combined with 3D component models. Unlike equivalent-circuit models, 3D models account for the coupling effects in densely packed designs, making it possible to predict real-life performance in these scenarios accurately.

What You Will Learn

  • How do 3D models differ from equivalent-circuit models?

We’ll explain how Modelithics 3D models are based on the physical characteristics of each component. These models can be used in full-wave 3D EM simulations, enabling designers to simulate the effects of parts close to one another.

  • Case study #1: An LC filter with components spaced apart

We’ll show an LC filter designed in HFSS with components located relatively far from one another.  Simulating with equivalent-circuit models produces accurate results in this scenario due to the spacing between components.

  • Case study #2: An LC filter with components close to one another

We’ll show an LC filter designed in HFSS with components close to one another. In this scenario, the most accurate results are achieved when utilizing 3D models.

Who Should Attend

PCB Designers, RF engineers


Chris DeMartino is an Applications Engineer at Modelithics. Before working at Modelithics, he worked at several other companies developing and testing RF/microwave components and assemblies for various applications. In addition, Chris spent several years working as a technical editor for an industry publication. Chris has a B.S. in Electrical Engineering from the State University of New York at Binghamton and an M.S. in Electrical Engineering from Polytechnic University (now NYU Tandon School of Engineering).