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Ansys 2024 R1: Ansys Thermal Integrity What’s New

Join us on March 27th to hear about the latest updates and newest features in Ansys Icepak and Ansys Mechanical Thermal. Some new capabilities include breakthroughs that will be of considerable use to engineers involved in hardware design for Telecommunications, Consumer Electronics, A&D, and Automotive products.


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The 2024 R1 release includes updates, enhancements, and new features for both Ansys Icepak and Ansys Mechanical Thermal. Those new capabilities include breakthrough functions that considerably impact engineers developing products in markets such as HPC, Automotive, A&D, and Consumer Electronics.

What you will learn

  • Thermal Mesh Fusion for Icepak
  • New GPU solver for Icepak
  • Transient thermal solver for Mechanical Thermal
  • Introduction of Thermal & Structural Layout Components with Trace Mapping in Mechanical Thermal

Who should attend and why

Engineers involved in hardware design for Automotive, A&D, Consumer Electronics and RF.


  • Jeff Tharp
Icepak Thermal