Skip to Main Content

 

Technical Paper

Fostering Thermal Design Innovation using Chip-Package-System Analysis Techniques

This paper outlines the Ansys design flow to dissipate heat within electrical packages and PCB's.

 

SHARE THIS TECHNICAL PAPER

Découvrez ce qu'Ansys peut faire pour vous

Contactez-nous aujourd'hui

* = Champ requis

Merci de nous contacter !

We’re here to answer your questions and look forward to speaking with you. A member of our Ansys sales team will contact you shortly.

Image de pied de page