How to Predict Thermal Cycle Failures of Electronics
Temperature cycling is the biggest challenge for ensuring reliability in electronics. This is because the coefficient of thermal expansion (CTE) can differ widely between the various materials that make up an electronics assembly. The CTE mismatch between materials causes mechanical stresses during heating and cooling.
This webinar discusses component level reliability, board level reliability and system level interactions that affect reliability. The methodology used in Ansys Sherlock for calculating solder joint fatigue and plated through-hole fatigue due to thermal cycling will be presented, along with examples and case studies of solder fatigue predictions.