Skip to Main Content

Webinar

Ansys Icepak and Sherlock For Temperature Cycling

This webinar will demonstrate an automated process of thermal modeling of printed circuit boards. It will present a workflow to translate ECAD data to a thermal and mechanical model in Ansys Icepak, followed by the transfer of results into Ansys Sherlock for solder fatigue analysis.

 

SHARE THIS WEBINAR

Bereit, das Unmögliche zu lösen?

Kontaktieren Sie uns

* = Pflichtfeld

Danke für die Kontaktaufnahme

We’re here to answer your questions and look forward to speaking with you. A member of our Ansys sales team will contact you shortly.

Racecars on a track