Fabrication and Protection of Integrated Circuits (ICs) – Two Simulation Techniques You Should Know!

Learn why Semiconductor Engineering Magazine referred to Ansys Charge Plus as “A tool uniquely suited to modeling and simulating charged plasmas and their sudden discharges with industry-leading accuracy” in this upcoming webinar.

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Overview

Integrated circuits (ICs) are created using complex and expensive fabrication processes. Optimizing this process can reduce manufacturing costs, accelerate development cycles, and improve yields. Once in the field, ICs must survive extreme electromagnetic environments.

This session will explore breakthrough simulation techniques.

Model the Plasma Enhanced Chemical Vapor Deposition (PECVD) process for a semiconductor chamber.
Perform RadHard simulation using advanced ray tracing to generate dose/depth curves and assess the shielding effectiveness of electronic designs.

What Attendees Will Learn

CAD File Preparation: Master the process of importing mechanical CAD designs, assigning materials, and preparing for simulations
Accurately solve 3D plasma dynamics in PECVD, sputtering, and etching chambers, promptly
Fast creation of ionizing dose maps for sensitive components in arbitrarily complex CAD geometries
Workflow for producing characteristic dose-depth curves for different orbital scenarios
Performance Evaluation: transform simulation results into formats that facilitate comparison with standard measurements for device performance assessment

Who Should Attend and Why

Engineers and physicists who design, fabricate, and deploy ICs in their design.

Speaker

Dr. Kevin-Druis Merenda - Lead Software Product Manager, EMA