Ansys 2026 R1: What’s New in Thermal Integrity in AEDT Icepak

Overview

Ansys Icepak has long been a powerful solution for electronic thermal management. The latest release, AEDT Icepak 2026 R1, builds on this foundation with a range of new capabilities designed to enhance workflows, usability, and overall simulation effectiveness.

This release delivers a significantly improved user experience through solver and post‑processing performance enhancements, along with an optimized user interface for handling large models. New UI features such as part suppression, coordinate snapping, CTM visualization, and heat‑flux vector plotting streamline model setup and analysis. The refreshed interface with updated icons further improves usability and navigation.

AEDT Icepak 2026 R1 also introduces an enhanced Native Joule Heating solver with improved robustness and support for defining electrical contact resistance on plate boundaries. A new toolkit for creating Delphi‑like Surrogate Thermal Models enables efficient thermal characterization of electronic components. In addition, the release includes important enhancements for package‑level and PCB workflows.

Overall, AEDT Icepak 2026 R1 is a user friendly and powerful platform that significantly improves engineering productivity. This webinar will highlight the key new features and demonstrate how the latest version of Ansys Icepak helps engineers perform more robust and efficient thermal analyses.

What Attendees Will Learn

• Meshing, solver, and post‑processing improvements
• Part and component activation/deactivation
• Enhanced Joule Heating solver
• Coordinate snapping, heat exchanger boundaries, and DTM capabilities
• Surrogate Thermal Model workflow
• Package‑level and PCB workflow enhancements

Who Should Attend

• Icepak Users
• Design Engineers
• Thermal Simulation Engineers
• CFD Engineers & Analysts

Speakers

• Sreeharsh Nair
• Subodh Deodhar