TSMC and Ansys enable multi-die analysis in advanced packaging technologies
PITTSBURGH, April 30, 2018 – TSMC validates Ansys® RedHawk™, Ansys® RedHawk-CTA™ and Ansys® CSM™ for TSMC Wafer on Wafer (WoW) and Chip on Wafer on Substrate (CoWoS®) advanced packaging technologies. The solutions include die and package co-simulation and co-analysis for extraction, power and signal integrity analysis, power and signal electromigration analysis and thermal analysis. CoWoS and WoW technologies enable smaller package size through multiple dies integration.
"Advanced packaging technologies will be the key driver for achieving extreme performance, high-system bandwidth and low power in leading-edge high-performance computing (HPC), cloud computing and automotive electronics systems," said Suk Lee, TSMC senior director, Design Infrastructure Marketing Division. "The solution enablement with Ansys supports customers performing advanced multi-die simulations to achieve their desired performance and reliability goals."
"Through exploration, prototyping and signoff, Ansys' industry-leading solutions can be used across the entire design spectrum, from chip to package to system," said John Lee, general manager at Ansys. "Close collaboration and partnership with TSMC ensures customers can design next-generation semiconductor chips with confidence."
If you've ever seen a rocket launch, flown on an airplane, driven a car, used a computer, touched a mobile device, crossed a bridge, or put on wearable technology, chances are you've used a product where Ansys software played a critical role in its creation. Ansys is the global leader in engineering simulation. We help the world's most innovative companies deliver radically better products to their customers. By offering the best and broadest portfolio of engineering simulation software, we help them solve the most complex design challenges and create products limited only by imagination. Founded in 1970, Ansys employs thousands of professionals, many of whom are expert M.S. and Ph.D.-level engineers in finite element analysis, computational fluid dynamics, electronics, semiconductors, embedded software and design optimization. Headquartered south of Pittsburgh, Pennsylvania, U.S.A., Ansys has more than 75 strategic sales locations throughout the world with a network of channel partners in 40+ countries. Visit www.ansys.com for more information.
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