Design Cooler, Fail Less: Electronics Cooling with Ansys Icepak and Ansys Discovery
Optimize thermal performance in your electronic designs to safeguard against failure and ensure reliability. Register now for faster, smarter modeling solutions!
DATE/TIME:
June 24 , 2025
1 PM EDT
Venue:
Virtual
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Overview
Access cutting-edge electrothermal simulation strategies in this expert-led webinar that dives deep into the leading-edge capabilities of Ansys Icepak and Ansys Discovery, reshaping how engineers innovate and simulate their electronics product designs. Experience how real-time multiphysics simulations fuel your ability to explore, test, and refine your designs faster during the earliest stages of development.
What You Will Learn
- Analyze and Optimize Electronics Cooling Early: Leverage real-time simulation to evaluate and refine, in the design concept stage, your thermal management strategies
- Modify Designs Instantly with Direct Modeling: Make quick, intuitive changes to your geometry without the constraints of traditional modeling
- Connect Your Workflow with Seamless Integration: Maintain a smooth digital thread from initial simulation in Discovery to thermal signoff in Icepak, ensuring accuracy and consistency throughout your process.
Who should attend
Mechanical Engineers, Thermal Engineers, Electrical Engineers, Package & IC Designers, Ansys Icepak and Ansys Discovery Users, Design Engineers, and all other Simulation Engineers involved in electronics design.
Speakers
- Carlos Gomez
- Viral Gandhi
- Ethan Thompson