Skip to Main Content

2019

Webinar

Multiphysics Optimization of Electronics Systems Using Ansys Icepak, Ansys Mechanical and Ansys optiSLang

Electronics systems are becoming more and more compact and require sophisticated optimization techniques to achieve optimal performance. The growing complexity of the design space makes it very difficult for engineers to identify the key variables that need to be optimized. A multiphysics solution is needed.

View this on-demand webinar to learn about a leading-edge optimization procedure applied to the thermomechanical setup of an electronics system. The procedure involves multiphysics thermomechanical analyses using Ansys Icepak and Ansys Mechanical, followed by system optimization using Ansys optiSLang within the Ansys Workbench framework. Using this process, you can optimize your design for minimal heat sink mass, fan flow rate and thermal stress while constraining the temperature within a given limit.
 

SHARE THIS WEBINAR

Bereit, das Unmögliche zu lösen?

Kontaktieren Sie uns

* = Pflichtfeld

Danke für die Kontaktaufnahme

We’re here to answer your questions and look forward to speaking with you. A member of our Ansys sales team will contact you shortly.

Racecars on a track