Skip to Main Content

 

Webinar

Ansys-Synopsys Technology Update: The Latest Advances in Multi-Die Design

The semiconductor industry is rapidly adopting 2.5D and 3D multi-die designs as the significant benefits have become clear for applications like HPC, GPU, mobile, and AI/ML. Multi-die design technology has been quickly evolving and early experiences have led to the development of more advanced implementation and analysis techniques.

Synopsys and Ansys have created a unified design flow that carries designers from early exploration to implementation, to final signoff. They are deeply engaged with semiconductor designers on advanced multi-die projects and have helped customers bring successful designs to market. 

What You will Learn:

  • Multi-die design best practices for thermal, signal, and power integrity
  • Insights from practical multi-die design case studies
  • More advanced packaging technologies for thermal management, backside power, and co-packaged optics
image1.png

SHARE THIS WEBINAR

Los geht's

Wenn Sie mit technischen Herausforderungen konfrontiert sind, ist unser Team für Sie da. Mit unserer langjährigen Erfahrung und unserem Engagement für Innovation laden wir Sie ein, sich an uns zu wenden. Lassen Sie uns zusammenarbeiten, um Ihre technischen Hindernisse in Chancen für Wachstum und Erfolg zu verwandeln. Kontaktieren Sie uns noch heute, um das Gespräch zu beginnen.