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Ansys 2021 R1: What’s New in Ansys Icepak — Mechanical Thermal Solution

Join us to learn about a new Ansys Mechanical design type — the Mechanical Thermal solution — now available inside Ansys Electronics Desktop (AEDT). This solution streamlines the workflow linking electromagnetic designs from Ansys HFSS, Ansys Maxwell and Ansys Q3D Extractor  for quick thermal insight.

Register to learn more about: 

  • How to use the new Mechanical Thermal solution to quickly connect to electromagnetic designs
  • How to use the reduced order modeling (ROM) workflow with Icepak in AEDT
  • How to take advantage of the enhanced network boundary conditions in Icepak


Speaker: Jim Delap, Product Manager

Bio: Jim DeLap is Director for Electronics product management at Ansys. He has worked in the microwave and RF community for over 25 years, and has a master's degree from the University of Virginia. He specializes in high-frequency and millimeter-wave IC and module design with further emphasis on thermal and electromagnetic effects in ICs and packages.


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