Designing reliable data centers with Ansys simulation solutions

From Systems to Silicon: Solutions at Every Scale.

Maximize uptime with an end-to-end systems-to-silicon approach for data center design, optimization, and operations. By uniting silicon design, multiphysics simulation, and digital twins, engineers enable chip-to-grid virtual prototyping that predicts performance, power, and thermal behavior across components, systems, and infrastructure − accelerating AI, cloud, and HPC development while improving efficiency, reliability, and design confidence.

Manage power delivery from grid to rack and maximize uptime

Anticipate signal and power requirements, thermal interactions, and structural integrity issues from chip to rack across scales, ensuring reliable performance of processors, accelerators, memory, servers, racks, power delivery, networking, and thermal management systems.

Boost high-density interconnect speed and efficiency

Enhance performance and reliability by analyzing thermal, electrical, and mechanical behavior of co-packaged optics, optimizing signal integrity, power delivery, and packaging reliability in high-density AI factory environments.

Increase cooling efficiency, minimize thermal risk

Predict airflow, heat transfer, and cooling effectiveness across servers, racks, containment and air/liquid cooling systems through conjugate heat transfer analysis, improving thermal design, reliability, and data center energy efficiency.

Monitor, simulate, and optimize operations continuously

Leverage digital twin technology to simulate and predict failures, monitor performance from component to facility level, and optimize operations in real time − improving load handling, reliability, and energy efficiency.