Design Exploration of RF GaN Amplifier, 3D Packaging, and Thermal Analysis

Join us for this webinar on RF GaN amplifier design using electromagnetic/thermal 3D solvers. We will discuss the step-by-step process of building a GaN amplifier, beginning with the transistor model in the circuit simulator. The webinar will outline the steps required to convert this to a physical layout for electromagnetic simulation and verification while integrating packaging and thermal effects co-simulation to analyze a complete packaged system. Discover how this comprehensive approach yields innovative solutions, important design insights, and their potential impact on packaged performance.

Venue:
Digital

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What You Will Learn

Design and layout of a typical GaN amplifier using circuit
and 3D EM tools
Incorporation of 3D component models (connectors, packages etc) for complete system analysis
Co-simulation of packaged devices with thermal solvers

Who Should Attend

Electromagnetic and circuit design engineers: Delve into the co-
simulation nuances between circuit models and full 3D designs
System engineers: Develop an understanding of the packaged PA design and tradeoffs
Professionals in wireless communication: Gain comprehensive
insights into the modern circuit/package co-simulation
workflows

Speaker

David Edgar, Senior Manager Applications Engineer