In this webinar, IDC, Ansys, Infineon and Monolith will discuss:
Leverage Mechanical – Solution type in Ansys Electronics Desktop to quickly build and perform accurate analysis.
Learn how Ansys Cloud can accelerate Ansys Mechanical by managing high performance computing (HPC) in the cloud for faster, high-fidelity results. In this webinar, we will explore how Ansys Cloud accelerates simulation, heightens innovation and efficiency, and provides a secure, scalable, and cost-effective approach to HPC.
This presentation showcases the past, present and future of mobile networking, and how the convergence of 5G, edge computing and artificial intelligence machine learning will change the industry landscape. Modeling and simulation will drive this revolution—particularly in combining the physics of electromagnetics, optical, thermal, mechanical, and materials.
In this webinar, the advanced shooting and bouncing Ray (SBR+) method within Ansys HFSS will be presented as solution. We will address the placement of antennas, setup of moving trajectories and how to import models — including vehicles, areas of a street or parts of a city — to support your simulation. Additionally, critical post-processing capabilities and recommended solver settings will be discussed.
This webinar introduces the SynMatrix filter synthesis and optimization tool. This tool can be used to drive HFSS full wave simulation and filter tuning. It also introduce the optiSLang general purpose optimizer and its application to filter optimization.
A multi-physics linkage between three Ansys solvers is employed to show a filter response change to applied power and ambient temperature.
A live demonstration will spotlight how it can be combined in a hybrid simulation approach with finite-element boundary integral (FEBI) domains or reading in far-field or near-field sources. Additionally, key post-processing capabilities and recommended solver settings will be discussed.
Learn about Ansys’ complete on-chip tool suite, including Ansys RaptorH, Ansys Exalto and Ansys VeloceRF, which enables a complete EM-aware design flow and efficiently addresses electromagnetic effects across RFIC and high-speed applications.
Learn how Ansys Path FX can help you uncover silicon failures that would be missed by traditional STA flows, by accounting for both temporal and spatial variability on timing-critical paths. By capturing true post-silicon behavior, you can drastically improve the functional yield of your chips with confidence.
This presentation will discuss the various data paths in 5G systems and how Multiphysics analysis can help design these paths to allow for maximum data integrity.
Ansys medini for Cybersecurity helps secure in-vehicle systems and substantially improves time to market for critical security-related functions. It addresses the increasing market needs for systematic analysis and assessment of security threats to cyber-physical systems, starting early in the system design phase.
Ansys has developed a breakthrough technology, known as 3D Component Domain Decomposition Method (3D Comp DDM), that enables the accurate and efficient simulation of antenna arrays. Whether solving complex, electrically large antenna arrays, or relatively simple antenna arrays, this technology enables fast simulation without compromising on accuracy.
In this webinar, we provide an overview of the main challenges related to human exposure assessment to 5G electromagnetic fields, highlighting the growing importance of numerical approaches and their benefits compared to measurement. In particular, the capabilities of state-of-the-art simulation solvers will be demonstrated by showing examples of SAR and power density evaluation on realistic test cases.
In this webinar, the numerical technique of the domain decomposition based on 3D components within Ansys HFSS will be showcased with key examples.
A live demo will spotlight the setup procedure and post-processing capabilities will be presented, illustrating how you can define individual excitation for every individual cell as a post-processing operation.
Learn how to combine ECAD layout designs together, add mechanical CAD connectors or 3D component models in Ansys HFSS 3D Layout to accurately extract complex interconnect systems with 3D electromagnetic field simulation. This allows leading companies to break through the established silos of separate IC, package and board design and gain insight to the integrated IC-package-board design.
This presentation compares the technique versus solely using Ansys HFSS, and explains how you can balance tradeoffs between accuracy, simulation speed, ease of use, and employing high-performance computing (HPC) options to solve 3D regions in parallel. Additionally, this webinar spotlights Ansys’ future plans for improving HFSS Regions in SIwave.
Learn how Ansys HFSS 3D Layout simplifies modeling of layered structures such as printed circuit boards (PCB) and high-speed components. HFSS 3D Layout is ideal for designers who work with layered geometry or layout high-speed components, including on-chip embedded passives, IC packages and PCB interconnects.
In this presentation, a workflow for the analysis of 5G phased array antennas and hand-held antennas will be demonstrated.
This webinar spotlights Ansys 2021 R1’s new capabilities for coupling accurate loss density calculations to thermal solvers for predicting temperature in bus bars.
This webinar spotlights the theoretical basis of various port types and how to use them in real designs to deliver maximum accuracy. We will provide a detailed look at wave ports and the transfinite element method.
Additionally, we will discuss lump ports (including coaxial), circuit ports and key de-embedding concepts.
Find out how pioneers like Qualcomm and AMD are using simulation to address these critical market needs by downloading the e-book.
Ansys Granta Materials Data for Simulation provides instant, clickable access to the materials property data you need with Ansys software.
Ansys Nuhertz FilterSolutions provides automated RF, microwave and digital filter design, synthesis, and optimization in an efficient, straightforward process.
The underpinning of global communications networks are the signal channels routing data at the fastest rates possible. Since summer of 2020, 224 Gbps channel data rates have been a reality. The race is on to develop 224 Gbps semiconductor and high-speed interconnect solutions.
Ansys simulation software for 5G provides a compelling set of design solutions from mobile user equipment to networks and beyond. Simulation applications include electronics thermal management, advanced RF front-end design, and radio desensitization and EMI issues in 5G Smartphones.
Designing 5G wireless systems is a huge undertaking. Antenna beamforming and beamsteering in 5G are key to improve the capacity and data rates for wireless applications. Massive MIMO, for instance, requires phased array antennas to be designed carefully to optimize the gain and ensure targeted coverage. Ansys tools are ideal for designing and simulating antennas, antenna-to-antenna coupling and environmental effects on signal propagation.
Ansys multiphysics simulations simultaneously solve power, thermal, variability, timing, electromagnetics and reliability challenges across the spectrum of chip, package and system to promote first-time silicon and system success.