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A Practical Discussion on Fatigue - White Paper

In this paper we overview the physical behavior responsible for fatigue from initiation to final component failure.

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Structural integrity is one of the most critical considerations in product design. Market pressures dictate that products are stronger, longer lasting and packed with customer-requested features. At the same time, the bottom line must drive time, costs and risk out of the product development cycle while creating ongoing innovations. By leveraging ANSYS software, engineering teams can simulate all structural aspects of a product — conducting linear static analyses that reveal stresses or deformations, modal analyses that determine vibration characteristics, and advanced transient nonlinear studies that focus on dynamic effects and complex behaviors.

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How the Energy Industry is Powering Global Prosperity with Pervasive Engineering Simulation - White Paper

Best-in-class energy companies are using simulation more than ever to meet the challenges of increasing product complexity, reducing lifecycle costs and getting new products to market quickly. This e-book describes how pervasive engineering simulation is helping them to overcome these challenges.

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Maxwell Time Decomposition Method Accelerates Simulation of Transient Electromagnetic Fields with Intel Xeon Processor E5-2697 v4 - White Paper

ANSYS teamed with INTEL to benchmark a new ANSYS Maxwell technology that delivers dramatic speed improvement for transient electromagnetic field simulations. Simulations that previously required weeks of computation time are now completed in a matter of hours. The key software technology is a new algorithm within Maxwell that allows engineers to solve time steps simultaneously as opposed to sequentially.

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Overcoming Thermal Management Challenges with Multiphysics Simulation - White Paper

Designing products, components and systems that can withstand a wide range of thermal scenarios is a design challenge that touches nearly every industry. From automobiles to high-speed semiconductors, thermal management concerns can often lead to wasted energy, reduced performance or premature device failure. This results in increased energy costs, warranty issues and additional design time that can reduce competitive advantage. To master thermal management design and truly understand thermal behavior of a system, streamlined multiphysics simulation tools are a necessity.

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6 Steps to Successful Board Level Reliability Testing

A 6 step guide to performing meaningful and relevant board level reliability testing for the semiconductor industry. For semiconductor manufacturers entering the automotive environment, the lack of universal qualifications standards often leads to inconsistent reliability expectations. The most efficient solution is to establish a robust and thorough BLR testing plan that is uniquely designed for a specific manufacturer validated by a broad range of industry experiences. 6 Steps to Successful Board Level Reliability Testing takes a step-by-step approach to explain how semiconductor manufacturers have to adopt board level reliability testing for the automotive electronics industry. The guide includes: Current challenges semiconductors are facing in the automotive industry, especially BLRT Best practices in adopting BLRT for the automotive industry Practical advice on how to develop a board level reliability test plan Key issues to consider while developing BLRT plans Complete the short form to download your free copy of the white paper.

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Working with ADPL Math Illustrated: Thermal Harmonic Analysis

Thermal harmonic analysis is used every time it is necessary to design a system with high immunity against thermal disturbances. It can be applied whenever stringent dimensional stability — hence thermal stability — is required. Read this white paper to learn how you can perform thermal harmonic analysis using ANSYS APDL Math software.