With 2021 R2, Ansys HFSS continues to bring groundbreaking technologies to address PCB and 3D-IC package design challenges as well as advancements in antenna design.
On the heels of Ansys HFSS Mesh Fusion, Ansys HFSS Phi Plus meshing features enable unrivaled speed and robustness for solving 3D-IC package challenges, especially geometries like wire bond-type packages.
This webinar spotlights Phi Plus meshing and discusses other powerful new features.
- Explore HFSS SBR+ for 3D dielectrics and how it efficiently simulates non-uniform dielectric structures such as radomes, lenses and automotive bumper fascia.
- Learn about increased speed for far field antenna post-processing, which proves useful for multi-port antenna simulations, including radars and 5G mmWave antenna array design.
- Discover how Ansys NuHertz FilterSolutions deliver automated RF, microwave and digital filter design, synthesis and optimization. Understand how it performs tight integration with HFSS to evaluate a broad range of filter topologies.