Skip to Main Content

 

Webinar

Enabling FinFET Thermal Reliability Signoff for IPs

Ansys Totem can solve the challenges faced by engineers trying to ensure thermal and electromigration (EM) reliability in advanced IPs. View this webinar to see a demonstration of self-heat analysis on an IP test case using Ansys Totem’s rich GUI interface. The demonstration will cover flow setup, debugging and result exploration for reliability signoff.

SHARE THIS WEBINAR

Ready to make the impossible possible?

Contact us

* = Required Field

Thank you for reaching out!

We’re here to answer your questions and look forward to speaking with you. A member of our Ansys sales team will contact you shortly.

Racecars on a track