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Exploring Ansys HFSS 3D Layout-Driven Assembly

Learn how to combine ECAD layout designs together, add mechanical CAD connectors or 3D component models in Ansys HFSS 3D Layout to accurately extract complex interconnect systems with 3D electromagnetic field simulation. This allows leading companies to break through the established silos of separate IC, package and board design and gain insight to the integrated IC-package-board design.

Presenter: Shai Sayfan Altman

27 October 2020

5 AM EDT / 9 AM GMT / 10 AM CET

Venue:
Online

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