Together, Dell EMC, ANSYS, Intel® and OCF have developed an integrated and customizable solution that bridges the technology gap between workstations and full-scale HPC clusters. It’s accessible to smaller businesses and accelerates manufacturing workloads, reduces time to production and lowers system costs.

This comprehensive, scalable solution is customized to fit your specific ANSYS workload requirements. Integrating everything your business needs, including ANSYS job management software as well as services, the Dell EMC Optimized Platform for ANSYS Workloads deploys fast and starts working for your business right out of the box.

Learn about the easy-to-use, timesaving design tools for adjoint-based shape optimization in ANSYS Fluent. In the webinar, we introduce a workflow with increased convergence speeds and automation for optimizing the following applications:

• Turbomachinery
• Heat transfer
• Internal flows
• External aerodynamics

Presenter: Frank Kelecy

The latest release of ANSYS additive manufacturing (AM) software includes these new features, among others:

• ANSYS Additive Prep has a new build processor which allows you to export a build file directly to an AM machine.
• ANSYS Workbench Additive enables you to switch easily between viewing the STL supports, mesh or element densities. It also features an option to remove STL supports after cooldown on the AM process sequencer.

ANSYS Additive Print also has multiple new features with regards to supports:

• Support-only cutoff enables you to cut the support from the part but leaves the part attached to the baseplate under the displacement after cutoff output option.
• The Support Groups feature enables multiple supports in a single simulation, including a mix of volume-less and solid support types.

Join us to learn about these new AM capabilities from ANSYS.

Connecting to ANSYS Cloud enables organizations to implement high-fidelity simulations much faster in high-performance computing (HPC) environments than in local machines/datacenters. Users can submit simulation jobs for ANSYS electromagnetic tools such as ANSYS HFSS, ANSYS SIwave, ANSYS Maxwell and ANSYS Q3D Extractor from the ANSYS Electronics Desktop to the Microsoft Azure hosted ANSYS Cloud. Read this application brief to learn about the details and benefits of running EM simulations in ANSYS Cloud.

Electromagnetic Crosstalk analysis is emerging as a fundamental necessity as a component of electronic system development. With the advent of advanced technologies and System on-Chip (SoC) architectures, ignoring electromagnetic crosstalk is highly risky resulting in significant delays in reaching the market on time as well significant cost over runs. This paper provides an overview of the state of the practice in electromagnetic crosstalk in the context of modern SoC designs, current industrial trends, and key adoption challenges.

High speed/frequency RF transceivers and SoCs for 5G, mobile, AI, automotive and networking applications are becoming increasingly susceptible to electromagnetic (EM) cross coupling effects. Learn how ANSYS on-chip EM solutions can accurately capture all electromagnetic phenomena for mitigating the risk of electromagnetic crosstalk-induced performance degradation and failure in high-speed, high-frequency and low-power RFICs and SoCs. See how NVIDIA applies ANSYS EM tools to address high-speed serial link design challenges that come with denser routings and aggressive floorplans, including on-chip EM crosstalk and large di/dt induced supply noise.

Presenters:

Dai Dai, Mixed Signal Design Manager, NVIDIA
Dai Dai received his B.S. degree from Tsinghua University, Beijing, China in 2010 and M.S. degree from the University of California, Los Angeles, in 2012, both in electrical engineering. He has been with Nvidia since 2013, where he is currently a Mixed-Signal Design Manager with the high-speed wireline team. His research interests include high-speed serial I/O transceiver designs, PLLs and data converters.

Yorgos Koutsoyannopoulos, Vice President, Engineering, ANSYS
Experienced Chief Executive Officer with a demonstrated history in the EDA and semiconductor industry. Strong business development professional skilled in entrepreneurship, enterprise software sales, EDA, semiconductors, management, startups and international transactions.