Engineering Resilient Space Systems: Electronic Reliability

Overview

Space missions demand unprecedented reliability from electronic systems operating in extremely harsh environments. From severe temperature cycling to mechanical shock during launch, space-bound electronics face challenges that can make or break missions. Traditional reliability assessment methods often fail to accurately predict performance in these extreme conditions, leaving mission-critical systems vulnerable to unexpected failures. 

In this webinar, attendees will gain practical insights into leveraging Ansys Sherlock's powerful simulation capabilities to ensure electronics reliability throughout mission lifecycles, from initial design through end-of-life operation. Whether you're developing next-generation rockets, satellites, or planetary rovers, this webinar will demonstrate how reliability physics analysis methods can significantly reduce mission risk and improve design confidence.  By incorporating simulation earlier in the product development process, engineering teams can reduce costly re-designs, accelerate qualification testing, and deliver electronics that withstand the unique challenges of space.

What You Will Learn

• The role of Ansys Sherlock and Reliability Physics Analysis (RPA) in the evaluation of electronic systems for space applications
• Methods for evaluating PCB reliability and predicting component lifetimes under environmental stress conditions, including thermal cycling, random vibration, mechanical shock, and other conditions
• How to integrate Ansys Sherlock, Ansys Mechanical, and Ansys Icepak into comprehensive workflows for space applications, focusing on system-level analyses (e.g., Systems with Enclosures)
• How to generate high-fidelity models for further study (e.g., Trace Modeling, Reinforcements) in Ansys Mechanical
• The role of scripting and automation in streamlining related workflows (using PySherlock and other PyAnsys tools)

Who should attend

• Aerospace Engineers