High-Tech: Innovation at the Speed of Light
As connectivity, digitalization and autonomy proliferate, the boundaries between industries are blurring at an unprecedented pace. Promising to unleash $3TN in global technology market spending, the new competitive battleground is to be found where the system electronics and semiconductor worlds collide: The 3D Integrated Circuit System-on-a-Chip.
Winning demands a new design paradigm that enables cross disciplinary multiphysics interaction, delivering innovation at the speed of light and unleashing disruptive competitive advantage – all with substantially reduced cost.
This e-book introduces the five critical capabilities required to deliver the new design paradigm supported by real world examples.