Ansys RedHawk-SC Electrothermal Datasheet
Next-generation semiconductor products increasingly rely on vertical integration technologies to drive system density, speed, and yield improvement. Due to the increased coupling effects across multiple physics, co-simulation and co-analysis of these phenomena are critical for a robust chip-package-system design. Advanced 2.5D/3D-IC systems are constructed with multiple dies, interposers, package and printed circuit board (PCB), which make the coupling effects even more of a challenge. Ensuring power integrity (PI), signal integrity (SI), thermal integrity (TI) and their interactions requires a new approach. Ansys RedHawk-SC Electrothermal™ is an innovative and comprehensive 2.5D/3DIC multiphysics prototyping and sign-off solution that addresses these challenges.