Accelerate Co-Packaged Optics Design with Multiphysics Tools

Overview

Co-packaged optics (CPO) are rapidly emerging as a critical technology for next‑generation AI, HPC, and datacenter systems, driven by the growing need to overcome the power, bandwidth, and scalability limits of traditional electrical interconnects. Industry leaders are increasingly investing in CPO architectures that integrate photonic and electronic ICs within advanced 2.5D/3D packages to enable high‑bandwidth, energy‑efficient optical I/O.

However, bringing production‑ready CPO systems to market requires solving tightly coupled multi‑physics challenges across photonic, electrical, thermal, and mechanical domains—along with accurate electro‑optic co‑simulation. This spans modeling RF signal propagation, parasitic effects, and signal integrity across electrical–optical interfaces, as well as optimizing fiber‑to‑chip coupling and package‑level thermal reliability.

In this webinar, we will demonstrate how a unified Ansys–Synopsys simulation workflow enables end‑to‑end CPO design. The flow integrates photonic device simulation (Lumerical), optical system modeling (Zemax), RF and package analysis (HFSS), and AI‑driven optimization (optiSLang) to accelerate design convergence and ensure robust system performance.

What Attendees Will Learn

• CPO architecture and application landscape
• Photonic IC and optical I/O design workflows
• Electro-optic co-simulation with RF integration
• Parasitic-aware signal integrity analysis
• Multiphysics simulation: thermal, optical, electrical coupling

Who Should Attend

Photonics engineers, RF and signal integrity engineers, semiconductor packaging engineers, and system architects working on optical interconnects and AI/HPC hardware.

Speaker

• Shruti Pandey