Ansys multiphysics solutions are enabled on Samsung's latest FinFET technology
PITTSBURGH, May 13, 2019 – Customers of Samsung Foundry and Ansys (NASDAQ: ANSS) are enabled to meet low power and high performance demands of next-generation 5G, artificial intelligence (AI), high performance computing (HPC) and automotive applications thanks to Samsung Foundry’s latest certification of Ansys’ multiphysics solutions for 5nm low power early (5LPE) process technology.
At smaller FinFET geometries, engineers face increased multiphysics challenges due to the complex interdependency of power, thermal and reliability effects. These challenges impact design convergence, affect project schedules and impede performance. Mutual customers can overcome these challenges and speed innovation by leveraging Ansys multiphysics solutions for 5LPE process technology that enables greater area scaling and ultra-low power benefits, when compared to its 7nm predecessor.
Samsung certified the Ansys® RedHawk™ family and Ansys® Totem™ multiphysics solutions for its latest 5LPE process technology. The certification includes extraction, power integrity and reliability, signal and power grid electromigration (EM). To support multiphysics needs in advanced nodes, the certification also includes thermal analysis and signoff with self-heat and statistical EM budgeting (SEB).
"This certification empowers mutual customers to achieve stringent power, performance area and reliability requirements for 5G, AI, HPC and automotive applications," said Jung Yun Choi, vice president of Design Technology Team at Samsung Electronics. "Using Ansys solutions, our customers can overcome complex multiphysics challenges in advanced FinFET designs to enable silicon success."
"With narrowing design margins in sub 7nm process nodes, guard banding becomes difficult without accurately modeling the physical, electrical and thermal effects that are prone to cause silicon failure," said Vic Kulkarni, vice president, strategy at Ansys. "As a leader in multiphysics simulations, we empower mutual customers to leverage best-in-class solutions to conquer the toughest power, thermal and reliability challenges to promote silicon success."
If you’ve ever seen a rocket launch, flown on an airplane, driven a car, used a computer, touched a mobile device, crossed a bridge or put on wearable technology, chances are you’ve used a product where Ansys software played a critical role in its creation. Ansys is the global leader in engineering simulation. Through our strategy of Pervasive Engineering Simulation, we help the world’s most innovative companies deliver radically better products to their customers. By offering the best and broadest portfolio of engineering simulation software, we help them solve the most complex design challenges and create products limited only by imagination. Founded in 1970, Ansys is headquartered south of Pittsburgh, Pennsylvania, U.S.A., Visit www.ansys.com for more information.
Ansys and any and all ANSYS, Inc. brand, product, service and feature names, logos and slogans are registered trademarks or trademarks of ANSYS, Inc. or its subsidiaries in the United States or other countries. All other brand, product, service and feature names or trademarks are the property of their respective owners.
We’re here to answer your questions and look forward to speaking with you. A member of our Ansys sales team will contact you shortly.