Scaling and Optimizing Data Center Cooling from Silicon to Room

Overview

As AI workloads continue to drive unprecedented increases in chip power density and rack-level power consumption, traditional air-cooling approaches are reaching their limits. Liquid cooling is rapidly becoming essential for next-generation data centers, enabling reliable operation of high-performance GPUs, AI servers, and hyperscale computing infrastructure. In this webinar, Synopsys experts will explore a comprehensive "chip-to-rack" approach to thermal management, demonstrating how multiphysics simulation and digital engineering technologies can optimize cooling performance across the entire data center (DC) ecosystem. Attendees will learn how leading organizations are addressing thermal challenges associated with AI factories, direct-to-chip liquid cooling, immersion cooling, high-power busbars, and liquid-cooled server architectures. 

This webinar will highlight how Synopsys solutions − including Ansys Icepak®, Ansys Fluent®, Ansys Thermal Desktop®, Ansys RedHawk-SC ET®, and Ansys TwinBuilder®− enable engineers to model, analyze, and optimize thermal performance across the AI computing stack, from advanced silicon, 3D-ICs, and semiconductor packages to PCBs, servers, and high-density liquid-cooled racks. Real-world customer applications and emerging industry trends will demonstrate how simulation-driven design accelerates innovation while improving thermal reliability, cooling efficiency, and scalability for next-generation AI infrastructure.

What Attendees Will Learn

• Understand why AI-driven DCs are accelerating the shift from air cooling to liquid cooling
• Explore thermal design challenges across the AI computing stack − from chip, 3D-ICs, packages, and PCBs to servers and high-density racks.
• Learn how direct-to-chip, cold plate, immersion, and two-phase cooling technologies are modeled, evaluated, and optimized.
• Discover how Synopsys multiphysics simulation and digital twin technologies enable silicon-to-rack thermal analysis and design optimization.
• Review real-world applications involving AI GPUs, liquid-cooled servers, high-power busbars, and next-gen AI DC cooling systems.

Who Should Attend

Data Center Architects & Infrastructure Engineers, Mechanical Engineers, Thermal Engineers, Data Center Cooling Specialists, Electrical & Electronics Design Engineers, Technical Leaders, Simulation & Modeling Engineers using Ansys software (Icepak, Twin Builder, Fluent, Thermal Desktop, RedHawk-SC ET), CAE Specialists, and R&D Teams.

Speakers

• Viral Gandhi - Applications Engineering, Director, Ansys part of Synopsys
• David Geb - Applications Engineering, Principal Engineer, Ansys part of Synopsys
• Jean Lachapelle - Product Marketing, Sr Staff, Ansys part of Synopsys
• Mary Beth Barrans - Product Marketing, Sr Staff, Ansys part of Synopsys