Skip to Main Content

 

Webinar

Thermal Integrity and Thermal-Aware EM Reliability Check for 3D Stacked Dies in EV-HEV

Power and performance are key requirements for EV/HEV. The electronics in a modern automobile must operate in a high temperature environment — such as under the hood — without sacrificing performance. Thermal integrity and thermal-aware reliability are some of the biggest concerns that can affect power (leakage), IR, timing and electromigration (EM).

Learn how Freescale uses Ansys RedHawk, SIwave, and Sentinel-TI to design 3D stacked dies (memory on top of SoC) that can improve power consumption and channel communication speed, while mitigating thermal interaction and reliability issues. Discover how Freescale’s model-based thermal-aware power noise and reliability methodology can help you improve your 3D stacked die design.

SHARE THIS WEBINAR

现在就开始行动吧!

如果您面临工程方面的挑战,我们的团队将随时为您提供帮助。我们拥有丰富的经验并秉持创新承诺,期待与您联系。让我们携手合作,将您的工程挑战转化为价值增长和成功的机遇。欢迎立即联系我们进行交流。