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Efficient Preprocessing of Complex Electronics Assemblies Using Ansys Stacker Meshing

 

Date/Time:
May 22, 2026
11:30 AM EDT

Venue:
Virtual

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Overview

The Stacker Meshing workflow in Ansys Mechanical introduces a powerful and efficient approach for handling 2.5D geometries, particularly those found in electronic assemblies such as PCBs, BGAs, and semiconductor packages. By leveraging a layer‑based meshing strategy, the workflow captures true thickness and material variation without the overhead of full 3D geometric detail, enabling high‑quality meshes with significantly reduced computational cost.

While especially valuable to the electronics industry, Stacker Meshing is equally effective for any layered 2.5D structure across industries, including laminated composites, thin‑film assemblies, and other stacked configurations. Its automation, robustness, and solver‑friendly mesh generation make it a versatile solution for accelerating thermal, structural, and multiphysics simulations in a wide range of engineering applications.

What Attendees Will Learn

  • Attendees will learn the new paradigm for meshing available in Ansys Mechanical under Mesh Workflow.
  • Will understand what level of complexity can be handled with less pre-processing efforts.

Who Should Attend

  • PCB design & simulation
  • Semiconductor package modelling
  • BGA / chip‑package / IC assembly simulation
  • Electronics cooling & reliability engineering
  • Engineers from other industries whose geometry contains 2.5D parts, sub-assemblies.

Speaker

  • Aditya Kshatriya

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