使用经过生产验证的多物理场分析创建高效、可靠的设计
Ansys云原生解决方案提供无与伦比的容量,甚至可以加快最大的FinFET集成电路(IC)和3D/2.5D多裸片系统的完成时间。这些功能强大的多物理场分析和验证工具使用代工厂认证的黄金签核验证,可降低功耗、提高性能与可靠性,并降低项目风险。
产品组合
查看所有产品Ansys致力于通过向学生提供免费的仿真工程软件来助力他们获得成功。
Ansys云原生解决方案提供无与伦比的容量,甚至可以加快最大的FinFET集成电路(IC)和3D/2.5D多裸片系统的完成时间。这些功能强大的多物理场分析和验证工具使用代工厂认证的黄金签核验证,可降低功耗、提高性能与可靠性,并降低项目风险。
云原生弹性计算架构,可实现全芯片容量
This video briefly overviews the challenges and solutions addressed by Ansys Semiconductor software products for the Electronic Design Automation (EDA) market. Semiconductor design is going through an inflection point as designers face two significant challenges rooted in manufacturing advances: The first is the ongoing march of Moore’s Law into advanced finFET process technology below 5nm. We see newtransistor architectures like nanosheet gate-all-around (GAA) and back-side power delivery.The second set of challenges facing semiconductor designers relates to multi-die design, 2.5D/3D-IC packaging, and heterogeneous integration. Leading design teams have adopted these advances as they face various novel multiphysics challenges to succeed with 3D-IC. New multiphysics challenges include
"Analyzing the dynamic voltage drop in highly complex chips has always been a challenge. Using sigmaDVD simulation technique by Ansys, it is possible to generate tens of thousands of unique switching scenarios and a higher coverage of IR-drop hotspots."
"Using Ansys RedHawk-SC and OptisLang, we could speed up the Power Distribution Network (PDN) exploration process by a factor of 10, taking it from weeks to hours."
"Using sigmaDVD technique by Ansys, NXP achieved a significant reduction by 4X in the overall time required for voltage drop analysis across the Power Distribution Network (PDN) ."
"Illuvatar maximized the power efficiency of GPGPU by 10X (10 times) by optimizing the RTL power, using Ansys PowerArtist."
"Ansys RedHawk-SC Security enabled us to verify the full-chip resiliency against Laser Fault Injection (LFI) and allowed us to make precise layout-level design fixes for critical cells that failed the LFI threshold."
半导体产品系列极大地提升了先进节点芯片的性能和容量,为多芯片设计的热和多物理场分析提供了全新功能。
Ansys Semiconductor产品提供一套综合全面的多物理场EM/IR、热和电磁仿真引擎,旨在支持数字和晶体管级设计的第三方IC实施流程。
核心产品基于超高容量、云原生SeaScape™平台构建,该平台使用弹性计算大数据机器学习架构,在数千个CPU内核上实现近似的可扩展性。
我们乐意随时解答您的问题,并期待与您进一步沟通。Ansys销售团队人员将很快与您联系。