Electromagnetics Product Highlights
Before a product becomes smart, connected or immersive, it must first incorporate electronic components. Consumer demand for system autonomy, increased wireless content, improved thermal performance and power efficiency is driving significant manufacturer demand for robust electronic and electromechanical design processes. ANSYS 18 delivers key new functionalities to address these product development challenges and opportunities, focusing on automated simulation and design workflows for antennas, high speed electronics and electric machines.
With ANSYS 18, you can now simulate large-scale electronic platforms using the new streamlined antenna and wireless design workflow with an enhanced antenna design kit, broadband adaptive meshing and the integration of HFSS SBR+ (shooting and bouncing ray) capabilities for large-scale electromagnetic simulation. The chip-package-system workflow extends its system assembly capabilities by linking ECAD and MCAD with transient circuit simulation and IC models. The low frequency electromagnetic design flow is now enhanced with the automated Time Decomposition Method (TDM) for rapid and HPC-scalable simulations, along with magnetostriction analysis linking electrical, thermal and structural domains.
Now you can simulate antennas in large electronic platforms with SBR+ in HFSS
The ANSYS HFSS SBR+ solver has been integrated into the HFSS desktop. HFSS SBR+ predicts performance of antennas mounted to large electronic platforms such as automobiles, aircraft, ships or within urban environments — problems previously considered too large to solve.
Get faster, more efficient results with automated broadband adaptive meshing
The new Broadband Adaptive Meshing solution fully automates the ability of HFSS to efficiently and quickly refine the mesh across a device’s frequency spectrum. Now you simply select the low and high frequencies, and HFSS automatically refines the mesh using information across the entire frequency band and optimizes the mesh considering all of the results.
Now you can perform 3-D layout assembly with integrated transient circuit simulation
ANSYS 18 introduces the new capability to perform transient circuit simulation of ECAD and MCAD assemblies directly from layout for full system verification. Engineers can assemble an electronic system with IC packages, sockets, printed circuit boards and connectors, then perform electromagnetics plus transient circuit analysis of that system automatically.
Get faster results than ever with Maxwell TDM auto-setup on HPC clusters
ANSYS 18 offers a new auto set-up for the Time Decomposition Method (TDM) for ANSYS Maxwell. Any engineer can automatically launch Maxwell TDM jobs on an HPC cluster while maximizing performance and providing the most efficient use of that cluster. The TDM algorithms have also been optimized to enhance scalability as the problem size gets larger.
Design efficient, quiet electric motors
A new multiphysics capability in ANSYS 18 enables you to link ANSYS Maxwell and ANSYS Mechanical to simulate effects of magnetostriction in motors and transformers. With magnetostriction coupling, you are now empowered to deliver high performance, reliable motors and transformers that are quiet and efficient.
ANSYS HFSS 3D Layout extracts frequency domain information and attaches it to a transient time domain simulation to solve 3-D models of PCB layouts.