Ansys 2026 R1: Ansys Sherlock and Electronics Reliability What’s New
Join this webinar to explore the top electronics reliability highlights in Ansys Sherlock 2026 R1.
Ansys potenzia la nuova generazione di ingegneri
Gli studenti hanno accesso gratuito a software di simulazione di livello mondiale.
Progetta il tuo futuro
Connettiti a Ansys per scoprire come la simulazione può potenziare la tua prossima innovazione.
Gli studenti hanno accesso gratuito a software di simulazione di livello mondiale.
Connettiti a Ansys per scoprire come la simulazione può potenziare la tua prossima innovazione.
Join this webinar to explore the top electronics reliability highlights in Ansys Sherlock 2026 R1.
Date/Time:
April 28, 2026
11 AM EDT
Venue:
Virtual
This session showcases new and enhanced capabilities that improve reliability prediction accuracy, streamline workflows, and accelerate design decision making. Attendees will learn how tighter Sherlock integration enables faster PCB stackup updates and focused design evaluation, while new thermal-mechanical workflows deliver deeper insight into solder joint fatigue and system-level reliability behavior.
This webinar is ideal for electronics reliability engineers, PCB and packaging analysts, thermal‑mechanical simulation specialists, and CAE teams using Ansys Sherlock to improve durability predictions and design confidence.