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A High-capacity Solution for Power and Signal Integrity on 2.5D Silicon Interposers

The present trends in technology — such as increasing demand for computational power from CPUs and GPUs, connectivity driven by Internet of Things (IoT), data demands around connected and self-driving cars, and the design of processors optimized for artificial intelligence (AI) — require more functionality from integrated circuits. As designers struggle to find ways to scale with complexity and density limitations of traditional flat 2D-IC architectures, advanced packaging techniques offer an opportunity to continue functional densification and performance improvements while meeting form-factor constraints and cost. Interposers are an integral part of advanced packaging architectures, as they provide high connectivity between chiplets. Read this white paper to learn more about these challenges and Ansys' solutions for them.



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