Webinar

Thermomechanical Reliability of Electronic Components using Ansys Sherlock

Ansys Sherlock is the only physics of failure (PoF)-based electronics design software that provides fast and accurate life predictions for electronic hardware at the component, board and system levels in early design stages. Sherlock revolutionizes electronic design by empowering designers to simulate real-world conditions and accurately model PCBs and assemblies to predict failure due to thermal, mechanical, shock and vibration conditions.

Sherlock provides fast and accurate reliability predictions in the earliest design stages tailored to specific materials, components, dies, printed circuit board (PCB)/ball grid array (BGA) stackups and specific use conditions. With libraries containing over 500,000 parts, Sherlock translates ECAD into FEA models in minutes and provides insights before prototyping, eliminating test failures and design flaws. Mechanical and electronics designers and engineers, even non-FEA experts, can now quickly and easily predict the reliable lifetime of entire printed circuit board assemblies (PCBAs) under real-world conditions, before a product is even built.

In this webinar, learn how Sherlock can be used to perform the following analyses:

  • Solder fatigue (board level/1D)
  • Solder fatigue (system level/3D)
  • Natural frequency
  • Mechanical shock
  • Random vibration
  • Harmonic vibration
  • Plated through hole (PTH) fatigue

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