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Multiphysics Modeling of HBM for 3D Heterogeneous Integration

Join our webinar to discover how High Bandwidth Memory (HBM) overcomes memory challenges in 3D systems, achieving data rates over 1 TB/s.

Time:
December 5,  2024 
9:00 AM PST

Type of Event:
Virtual

Overview

To address the memory wall challenge in 3D heterogeneous integration systems, High Bandwidth Memory (HBM) in a 3D stacked configuration is the optimal solution. It can achieve data rates exceeding 1 TB/s, critical for AI and data center applications. However, integrating HBM with other chiplets on a single interposer brings significant Multiphysics integrity challenges. High power and local hotspots generate excessive heat, causing mechanical stress, performance degradation, and reliability issues for HBM in a 3DHI environment. This webinar will explore these multiphysics challenges and introduce innovative modeling and simulation solutions.

What attendees will learn

  • Multiphysics challenges in integrating HBM with other chiplets
  •  Simulation solution in the HBM ecosystem
  • HBM modeling techniques
  • Multiphysics simulation for optimized HBM integration

Who should attend?

  • IC/ Chip designers
  • IC/ Chip methodology engineers
  • 3DIC architects
  • System engineer

Speakers

Lang Lin, Principal Product Manager