La demande des consommateurs pour des produits intelligents et abordables pousse les entreprises du secteur High-Tech à chercher en permanence à réduire le prix, diminuer la consommation énergétique et augmenter la performance de leurs produits par l'intégration de fonctions discrètes.
L'électronique mobile, par exemple, repose sur des systèmes de communication sans fil permettant la connexion à Internet et aux stations de base. Pour fournir une connexion fiable, les ingénieurs doivent concevoir des systèmes de communication sûrs et multistandards (Bluetooth, WiFi, LTE…).
- Articles
- Designing Robust Electronics Systems - Article - ANSYS Advantage - V7 I2
- Avoiding the Perils of Electromagnetic Interference - Article - ANSYS Advantage - V4 I1
- Making the Switch - Article - ANSYS Advantage - V4 I2
- Predicting Circuit Board Hot Spots with Electrothermal Cosimulation - Article - ANSYS Advantage - V4 I2
- White Papers
- Webinars
Segments
Mobile Computing
Engineers designing mobile computing and communication products need to optimize form-factor, performance, and battery life while delivering a compelling user experience.
Consumer Electronics
Whether designing high-definition image sensors for digital cameras or high-performance graphics processors to enable a realistic gaming experience, successful consumer electronics companies focus on driving down cost, integrating functionality, increasing product reliability and speeding time to market.
Communications and Networking Equipment
The proliferation of mobile and Internet-connected products creates a significant amount of data that needs to be stored, accessed and processed at rapid speeds, requiring delivery of high-bandwidth data reliably and efficiently.
Storage and Cloud
Storage and cloud technologies are integral to our digital lives and made possible by electronics simulation software.
Applications
Design Reliable Wireless Communication Systems
Wireless communication systems are powering the smart products revolution. Today’s smartphones and networked devices support multiple wireless technologies, such as Bluetooth, Wi-Fi and LTE. This level of integration requires engineers to take steps to mitigate EMI/EMC issues as well as thermal issues.
Optimize Power, Performance & Cost
In the race to deliver low-cost, high-performance, power-efficient electronics and semiconductor products in a timely manner, engineers are adopting chip–package–system (CPS) design methodology that allows co-analysis and co-optimization across the entire system.
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