Ansys s'engage à préparer les étudiants d'aujourd'hui à la réussite, en leur fournissant gratuitement un logiciel de simulation.
Ansys s'engage à préparer les étudiants d'aujourd'hui à la réussite, en leur fournissant gratuitement un logiciel de simulation.
Ansys s'engage à préparer les étudiants d'aujourd'hui à la réussite, en leur fournissant gratuitement un logiciel de simulation.
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Accelerating Multiphysics Design Success at the Interaction of Chips and Systems
At the end of the design cycle, design challenges that emerge at 7nm and below with 2.5D/3D systems can't be an afterthought. A range of novel physical effects, from thermal analysis to electromagnetic interference and advanced 3D layout capabilities, needs to inform the design right from the prototyping stage. Ansys and Synopsys entered into a strategic alliance that delivers the industry's best EDA solution for these new challenges. Ansys' RedHawk-SC™ family of power integrity, thermal, and reliability signoff products integrated with Synopsys' best-in-class Fusion Compiler™ platform, 3DIC Compiler™ platform, and PrimeTime® signoff platform provides customers golden signoff accuracy for chip, package, and system-level effects within the Synopsys design environment. This enables rapid design exploration, early weakness detection, in-design analysis, voltage-timing optimization, thermal-aware reliability, and final signoff from within the place-and-route environment.
Ansys RedHawk-SC Electrothermal solves the electrical and thermal coupling interactions of 2.5D/3DIC structures in full detail for up to a billion instances, concurrently. Synopsys’ 3DIC Compiler platform provides a complete, end-to-end heterogeneous implementation for efficient 2.5/3D multi-die design and full- system integration. The result is a robust, integrated design development that accelerates 3D system-level convergence and optimizes power, performance, and area (PPA/mm3) for heterogeneous design and 3D integration. Customers can address their 3D multi-die, multi-node implementation with greater confidence and bring products to market more quickly.
The Ansys and Synopsys partnership delivers an unparalleled range of multiphysics signoff capabilities that extend from the transistor level all the way up to full system analysis. Synopsys implementation platforms work with Ansys system-level simulators to optimize today’s high-speed and power-dense electronics. This enables high-fidelity simulation and signoff of thermal, signal integrity (SI), reliability, and electromagnetic interference in a realistic context. System interactions are shifted left and anticipated in early prototyping to improve final system performance and avoid late-stage system integration surprises.
The Ansys and Synopsys partnership delivers an unparalleled range of multiphysics signoff capabilities that extend from the transistor level all the way up to full system analysis. Synopsys implementation platforms work with Ansys system-level simulators to optimize today’s high-speed and power-dense electronics. This enables high-fidelity simulation and signoff of thermal, signal integrity (SI), reliability, and electromagnetic interference in a realistic context. System interactions are shifted left and anticipated in early prototyping to improve final system performance and avoid late-stage system integration surprises.
"Power and thermal analysis of an individual die in isolation is no longer sufficient in a multi-die environment. Through our integration with Synopsys' 3DIC Complier, designers can better optimize their overall system solution for signal integrity, power integrity as well as thermal integrity, while achieving faster convergence during signoff."
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