January 26, 2021
It seems to be a law of engineering that systems tend to get more complex over time. What starts as a single component is soon interacting with other components mechanically or electronically as a system, and then individual systems interact on a larger scale of increasing complexity.
This is certainly happening in the fields of 5G communications, autonomous vehicles, the electrification of cars and aircraft, and the internet of things, among others. Engineering tools must expand their capabilities to keep up with these trends.
Ansys 2021 R1, our latest software release, gives you the power and capabilities to handle this complexity challenge. By keeping in close contact with all industries, we are able to anticipate their needs and incorporate changes into our simulation software so you have the tools you need when you need them.
In Ansys 2021 R1, this means we have enhanced the power and functionality of the Ansys Cloud so you can use high-performance computing (HPC) on-demand to increase the number of cores available to solve larger challenges in record time. For example, the introduction of Ansys HFSS Mesh Fusion simulation technology in this release makes it easy to simulate entire electromagnetic systems at once, like the electromagnetic transmissions of an entire room, with the help of Ansys Cloud.
Ansys 2021 R1 delivers groundbreaking enhancements in the electronics suite
Likewise, the new Ansys Speos optical simulation software release accelerates simulation time via Ansys Cloud, enabling you to get results up to 60 times faster. You can also combine your optical simulations with other Ansys solutions, such as Ansys Mechanical, Ansys Fluent and Ansys optiSLang, for streamlined and comprehensive simulation results.
Ansys Speos accelerates innovation with improved workflows,
innovative features and new capabilities
In fact, interoperability is a hallmark of the new release, which addresses system simulation challenges inherent in today’s more complex products.
For instance, optiSLang 2021 R1 design optimization software includes improvements in process integration, like supporting scheduler submissions in Ansys Electronics Desktop and supporting Ansys HPC licensing. Easy web app building and publishing via Ansys Minerva allows enterprise-wide application of process integration and design optimization (PIDO) simulation workflows.
Of course, we have also enhanced the capabilities of all our simulation solutions — structural, fluids, optical, semiconductors, embedded software and more — in Ansys 2021 R1. We’ll mention a few highlights at the end of this blog and do a deeper dive into the new features of these solvers in future blogs.
Ansys Cloud increases simulation throughput by removing the hardware barrier. Even if you are working from home, you can access the computing power of thousands of cores from within your Ansys solvers. Enhanced features of the Ansys Cloud in Ansys 2021 R1 include:
Ansys 2021 R1 platform solutions enhance simulation process and data
management (SPDM), process integration and design optimization
(PIDO) and cloud offerings
Here are just a few of the release’s many other highlights:
In Ansys 2021 R1, Ansys embedded software solutions enable even more
development optimization, increase communication among team
members and reduce embedded software project certification costs
For specific updates on each of Ansys’ product suites, please visit:
Ansys 2021 R1 is part of our never-ending commitment to continuously improve simulation solutions to meet your ever-increasing challenge to design better products faster. Watch for more blogs that expand upon the new capabilities we’ve added to Ansys 2021 R1.
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