PITTSBURGH, March 14, 2017 – As the number of smart, connected electronic devices grows, manufacturers of mobile, computer networking, automotive and industrial automation applications need to design power efficient, high-performing and reliable products at a lower cost – and often with a smaller and thinner footprint. To meet these growing demands, TSMC and Ansys are collaborating to enhance and deliver a comprehensive suite of design solutions for TSMC 7nm and Integrated Fan-Out (InFO) packaging technology.
TSMC has enabled Ansys solutions, including
Ansys® RedHawk™,Ansys® Totem™, Ansys® HFSS™ and Ansys® SIwave™ to perform a variety of multi-die analyses including extraction, power and reliability, signal and power integrity, and thermal and electromagnetic interference. The design enablement allows mobile and internet of things manufacturers to create cost-effective, thinner and highly reliable products, and enables computing and automotive designers to create reliable, energy efficient high-performance chips –optimized for electromigration and thermal effects, and operating continuously in mission critical equipment with Ansys’ fully validated integrated circuit and package-level solutions.
"Our collaboration with TSMC has enabled the delivery of power and signal integrity and reliability solutions for InFO packaging and 7nm process technologies,” said John Lee, general manager, Ansys. "The Ansys solutions empower our mutual customers to innovate beyond chip to package and system-level designs for mobile, high-performance computing, automotive and Internet of Things applications."
"Through intensive collaboration with Ansys, we enabled and certified its solutions to deliver the design solution that addresses reliability and power integrity considerations for mutual customers," said Suk Lee, TSMC senior director, Design Infrastructure Marketing Division. "The result ensures their readiness, enabling customers to analyze and design reliable power delivery networks across chip, package and system."
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