March 1, 2023
The Optical Fiber Communication Conference and Exposition (OFC) takes place March 7-9, 2023, at the San Diego Convention Center.
OFC is one of the world’s most significant events for optical networks and communications, representing a range of products from optical components and devices to systems, test equipment, software, and specialty fiber.
Visit Ansys at booth #4708 to explore our workflows with our electronics photonics design automation (EPDA) and foundry partners, the new capabilities in the Ansys 2023 R1 release, and Ansys’ end-to-end optics solution that combines Ansys Lumerical photonics simulation software, Ansys Speos optical system design software, and Ansys Zemax optical workflow and design software. A broad spectrum of Ansys ecosystem partners have booths at OFC, including tool and foundry partners GlobalFoundries, AIM Photonics, IMEC, SMART Photonics, LIGENTEC, and Tower Semiconductor.
At OFC, we’ll highlight new and existing workflows with EPDA and foundry partners, updates to the CML Compiler and Verilog-A support, new optical models for III-V materials, and workflows featuring Lumerical, Speos, and Zemax.
At OFC this year, Ansys will highlight the latest capabilities in our new and existing EPDA workflows that are available with our ecosystem partners.
New capabilities in our schematic-driven layout circuit design flow with Cadence Virtuoso® now enable an improved Spectre-INTERCONNECT interface and significantly faster electro-optical co-simulation.
A new KLayout integration with our component-level solvers enables component designers to start with photonic component layout in KLayout and directly send their layout to Lumerical multiphysics tools for performance predictions by simulations. This comes as a great complement to our integrated workflows between KLayout and Lumerical INTERCONNECT solver for layout-driven circuit simulations. Join our booth demos to see how users can go from layout driven directly to component characterization and circuit simulations.
Lumerical continues to expand support for process-enabled custom design of passive and active components. Key foundry data needed for custom components, such as the layer, material, and doping information, work with Ansys Layer Builder via a foundry process file. Stop by Tower Semiconductor’s talk at our booth for a sneak peek of how the Ansys Layer Builder can support foundry-compatible designs of advanced components such as active devices.
A series of new capabilities continue to improve our support for automated, multiplatform process design kit (PDK) development. These include newly defined intuitive input data formats for our CML Compiler; new advanced models such as for parametrized ring modulators; enhancements to the GlobalFoundries interoperability for photonic Verilog-A models; and a preview of our brand-new CML Compiler graphical user interface (GUI). We’ll be demoing the full breadth of our capabilities for PDK development.
The Ansys Optics product portfolio is uniquely positioned to empower designers with comprehensive, interoperable, and consistent solvers and workflows for modeling all optical circuits and systems. Join us at OFC booth #4708 to hear about our ecosystem partners’ exciting new capabilities and workflows.
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