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Design Cooler, Fail Less: Electronics Cooling with Ansys Icepak and Ansys Discovery

Optimize thermal performance in your electronic designs to safeguard against failure and ensure reliability. Register now for faster, smarter modeling solutions!

DATE/TIME:
June 24 , 2025
1 PM EDT

Venue:
Virtual

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Overview

Access cutting-edge electrothermal simulation strategies in this expert-led webinar that dives deep into the leading-edge capabilities of Ansys Icepak and Ansys Discovery, reshaping how engineers innovate and simulate their electronics product designs. Experience how real-time multiphysics simulations fuel your ability to explore, test, and refine your designs faster during the earliest stages of development.

What You Will Learn

  • Analyze and Optimize Electronics Cooling Early:  Leverage real-time simulation to evaluate and refine, in the design concept stage, your thermal management strategies
  • Modify Designs Instantly with Direct Modeling:  Make quick, intuitive changes to your geometry without the constraints of traditional modeling
  • Connect Your Workflow with Seamless Integration: Maintain a smooth digital thread from initial simulation in Discovery to thermal signoff in Icepak, ensuring accuracy and consistency throughout your process.

Who should attend

Mechanical Engineers, Thermal Engineers, Electrical Engineers, Package & IC Designers, Ansys Icepak and Ansys Discovery Users, Design Engineers, and all other Simulation Engineers involved in electronics design.

Speakers

  • Carlos Gomez
  • Viral Gandhi
  • Ethan Thompson

Join this webinar