Streamline Analog Design with Accurate, Actionable Insights and Greater Productivity
Analog mixed-signal (AMS) semiconductors face challenges from rising signal frequencies, increasing design sizes, and the demands of advanced silicon manufacturing processes. These factors introduce complex nonlinear multiphysics effects in interconnect wires, which design teams often struggle to model accurately. The impact of interconnects on circuit performance is so significant that precise modeling of electromagnetic, RF, thermal, optical, parasitic, voltage drop, reliability, power, and other multiphysics interactions has become essential for successful designs.
Interconnect models must be re-extracted for every layout iteration, incorporating all relevant physics—including package/system interactions—even for large-scale designs like multi-die (3D-IC) systems and memories.
The Ansys AMS product suite provides a mature and strategic solution to the multiphysics interconnect challenge and is certified by all major foundries.
Debugging AMS designs is often manual, inefficient, and time-consuming, significantly increasing design costs. Ansys accelerates design convergence with advanced root-cause parasitic analysis, enabling teams to quickly identify fixes, meet deadlines, optimize chip performance, and ensure product reliability.
