Experience the future of electronics thermal design with Ansys Icepak 2025 R2 within the Ansys Electronics Desktop (AEDT) platform. This notable release transforms productivity with next-level user experience (UX) upgrades, turbocharged model creation, and GPU-driven simulation speed. The mesh fusion capability in Icepak software now delivers smarter, more robust automated meshing, and a powerful native network editor puts unmatched control at your fingertips.
Efficient Design Starts Here: Enhanced UX
The user interface (UI) and user experience (UX) of Icepak software within the AEDT platform received top-tier enhancements to make thermal simulation faster, more robust, and more intuitive. This high-priority effort delivers real productivity gains across the entire modeling workflow.
At the forefront of these improvements are new meshing and modeling tools that dramatically simplify setup without compromising control. The addition of snapping functionality enables faster and more precise geometry alignment, while enhanced manual mesh controls enable users with the flexibility needed for fine-tuning complex designs.
One of the most impactful upgrades, especially for longtime users, is the transition to a fully compiled import process for models from “Classic” Icepak via TZR Import. This marks the completion of a multi-release optimization effort, and the performance payoff is massive. Compared to the initial script-driven approach in 2024 R1, 2025 R2 delivers model loading up to 1,000x faster with the compiled import feature.
Another standout addition in this release is the introduction of the Solution Overview Reporter tool, which delivers live, dynamic feedback on key thermal performance metrics as the simulation runs.
The TZR import speed enhancement vastly accelerates importing “Classic” Icepak designs into the AEDT platform. Compared with 2024 R2, import times are up to 1,000 times faster.
Rather than waiting until a simulation completes to assess results, users can now monitor critical quantities in real time, gaining early visibility into whether their design is performing as expected. This enables faster decision-making, earlier troubleshooting, and more efficient iteration, all of which translate into significant time and cost savings.
With the Solution Overview Reporter, you are no longer in the dark while your simulation runs. Instead, you gain instant, actionable insight, empowering you to stay proactive, not reactive.
Accelerated Accuracy: Smarter Meshing With Thermal Mesh Fusion
The latest release of the thermal mesh fusion capability inside Icepak software redefines automated meshing by combining robustness, precision, and user control to accelerate confident design decisions of both design engineers and analysts.
Engineered for broader application support, this advanced meshing technology now delivers even stronger performance across complex thermal simulations. With intelligent auto-meshing, users can quickly generate high-quality meshes that drive accurate results right from the start.
Thermal mesh fusion enhancements: generating meshes using incremental levels
New in this release: the targeted mesh control capability, which employs automation for greater control and enables faster, smarter, and more reliable engineering decisions.
Analysts can now intuitively select objects for finer or coarser mesh refinement, striking the perfect balance between speed and fidelity. This user-driven enhancement puts customization at your fingertips, reducing setup time while enhancing simulation insight.
Expanded Use Cases for the Ansys Fluent GPU Solver
The integration of the Ansys Fluent GPU solver into Icepak software marks a transformative step toward ultra-fast high-performance electronics cooling simulations. Built for speed and scalability, the GPU solver accelerates solution times, empowering engineers to simulate faster and innovate sooner.
With this release, Icepak software continues to push the boundaries of GPU-accelerated computational fluid dynamics (CFD), reinforcing its position as a market leader in next-generation electronics thermal design. This update brings enhanced physics support, expanding the range of real-world electronics cooling scenarios that benefit from blazing-fast GPU performance.
In 2025 R2, the newly supported physics models dramatically extend the reach and impact of the Fluent GPU solver, unlocking more complex applications and delivering the speed to match your ambition. These include:
- Transient thermal solutions
- Nonuniform boundary condition support (temperature- and time-dependent)
- Support for all turbulence models
- Internal 2D and 3D fans
- Hybrid CPU/GPU solution support
- Significant solver speed enhancements
- Joule heating support
Thermal simulation speedup using hybrid CPU/GPU acceleration
Transient thermal improvements using GPU solver acceleration
Whether you're building models from scratch or migrating Classic Icepak to the AEDT platform, 2025 R2 sets a new standard in usability, accuracy, speed, and engineering efficiency. Learn more about Icepak software and the AEDT platform today.
